Revolutionizing Additive Manufacturing: Essentium’s HSC 180

https://www.youtube.com/watch?v=iTxIIbIjqJY

Welcome, everyone! I’m Blake, the CEO at Essentium, and we’re thrilled to unveil our latest innovation at Formnext 2019. We’re introducing the first three out of ten configurations for our HSC 180. But what’s HSC, you ask? It stands for High-Speed Extrusion, and it’s set to transform the world of additive manufacturing.

The Need for Speed

Our HSC 180 is not your average 3D printer. It’s a high-speed extrusion machine capable of printing parts between five and fifteen times faster than any other extrusion platform on the market. The key here is speed – we lay down plastic at an incredible pace, resulting in strong, accurate parts. But what’s the real magic? It unlocks a rapid return on investment (ROI) for our customers, with some seeing payback within a single month of deploying the HSC on their factory floors. This is a game-changer, no doubt!

The Material Marvel

Of course, a machine is only half the story. The other half revolves around materials. At Essentium, we’ve got both aspects covered, and we’re unveiling not one, not two, but four new materials. We’ve reformulated PEEK (Polyether Ether Ketone) for additive manufacturing, optimized for superior performance. In addition, we’re introducing three high-temperature nylon materials, including two that use our proprietary multi-layered filament structure.

This multi-layered filament structure breaks free from previous limitations, such as poor bonding strength and a lack of electrical conductivity. Imagine filaments that are loaded with carbon fiber, allowing us to 3D print tools, molds, and stiff structures for various applications, like circuit board assembly and final device assembly.

Exploring the Applications

Let’s dive into some exciting use cases. One of our new materials is the HTN CF 25, a high-temperature nylon with 25% carbon fiber. It’s designed to thrive at temperatures where typical nylons fall short. In this example, we’re using it to create a processing tray for circuit boards that can withstand the high temperatures of soldering. It’s a game-changer for electronics manufacturing.

But that’s not all. The HTN CF 25 is also ideal for electronic device assemblies, like an Amazon Echo Dot. These trays need to be strong, stiff, and ESD-safe (Electrostatic Discharge). They protect devices from static shocks, ensuring manufacturing tools meet the required safety standards. Our materials are even cleanroom safe, opening up a world of possibilities for a variety of industries.

Embracing the Future

Essentium’s HSC 180 and cutting-edge materials are shaping the future of additive manufacturing. The blend of speed and material innovation is opening up new possibilities and cost-saving opportunities for manufacturers worldwide. It’s an exciting time, and we can’t wait to see what you create with these new tools and materials.

Thank you for joining us at Formnext 2019. Stay tuned for more groundbreaking updates from Essentium as we continue to revolutionize the additive manufacturing community. The future looks promising, and we’re just getting started!